Lisa Su, chair and chief executive officer of Advanced Micro Devices Inc. (AMD), during the 2026 CES event in Las Vegas, Nevada, US, on Monday, Jan. 5, 2026.
Bridget Bennett | Bloomberg | Getty Images
AMD on Thursday said it will invest more than $10 billion across Taiwan’s semiconductor and AI ecosystem to advance chip production and performance.
Taiwan is at the center of the semiconductor industry because of Taiwan Semiconductor Manufacturing Co., the world’s largest chip manufacturer, which makes products for the most valuable companies in the world from Nvidia to Apple.
AMD has been a beneficiary of the continued heavy spending on AI infrastructure with its shares doubling so far this year as it looks to step up competition to rival Nvidia, which itself reported blowout earnings on Wednesday.
“Working with strategic partners in Taiwan and globally, AMD is advancing leading-edge silicon, packaging and manufacturing technologies that enable higher performance, greater efficiency and faster deployment of AI systems,” the company said in a press release.
The investments will focus on partnerships with companies to “advance” chip packaging and manufacturing required for next-generation AI infrastructure.
AMD said it is collaborating with Taiwan-based ASE and SPIL on areas such as the technology that links chips together, which can improve their performance efficiency.
The innovations are designed to support the deployment of Helios, its AI server system in the second half of 2026, the company said.
Sanmina, Wiwynn, Wistron and Inventec are among the partners that AMD named as helping to build Helios.
